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US 9,521,747 B2Granted
Connection board, optoelectronic component arrangement and illumination device
AssigneeOSRAM Opto Semiconductors GmbH
InventorsMichael Rasp, Konrad Wagner
Life of this patent
Estimating the term…
Abstract
A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through the cut-out.
Claims20
An optoelectronic component arrangement comprising:
- a connection board comprising a first contact surface,
- a second contact surface electrically isolated from the first contact surface, and at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in the fastened state by a fastener that extends through the cut-out,
- a first component that generates radiation and electrically conductively connects to the first contact surface, and
- a second component that generates radiation and electrically conductively connects to the second contact surface,
- wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in a fastened state on the installation board,
- the first component and the second component comprise at least one luminescent diode chip, and
- the fastener non-positively connects with the installation board.
4 more elements
An optoelectronic component arrangement comprising:
- a connection board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface,
- a first component that generates radiation and electrically conductively connects to the first contact surface, and
- a second component that generates radiation and electrically conductively connects to the second contact surface,
- wherein
- the first component and the second component are luminescence diode chips,
- the first component and the second component are electrically contactable independently from one another prior to being fastened to the installation board,
- the first component and the second component electrically connect in parallel to one another via the first contact surface and the second contact surface when the connection board is in a fastened state on an installation board.
4 more elements
An optoelectronic component arrangement comprising:
- a connection board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface,
- a first component that generates radiation and electrically conductively connects to the first contact surface, and
- a second component that generates radiation and electrically conductively connects to the second contact surface,
- wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in a fastened state on an installation board;
- the first component and the second component electrically conductively connect to a common counter contact;
- the connection board comprises a metal body and an insulation layer arranged on the metal body;
- the metal body forms the common counter contact;
- and
- the first contact surface and the second contact surface are arranged on a side of the insulation layer, said side being remote from the metal body.
6 more elements
An optoelectronic component arrangement comprising:
- a circuit board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface,
- a first component that generates radiation and electrically conductively connects to the first contact surface, and
- a second component that generates radiation and electrically conductively connects to the second contact surface,
- wherein the first contact surface and the second contact surface electrically connect to one another when the circuit board is in a fastened state on an installation board, and
- the first component and the second component comprise at least one luminescent diode chip,
- wherein the circuit board comprises a metal body and an insulation layer arranged on the metal body.
3 more elements
An optoelectronic component arrangement comprising:
- a connection board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface,
- a first component that generates radiation and electrically conductively connects to the first contact surface, and
- a second component that generates radiation and electrically conductively connects to the second contact surface,
- wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in a fastened state on an installation board,
- the first component and the second component comprise at least one luminescent diode chip, and
- the first component and the second component electrically conductively connect to a common counter contact.
3 more elements
Dependencies are inferred from the claim text.