Filtered feedthrough assembly for implantable medical electronic devices

A filtered feedthrough assembly for an implantable medical device, comprising:

• a ferrule configured to be attached to a metal case of the implantable medical device;
• an electrical insulator coupled to the ferrule by an electrically conductive connection element;
• a plurality of feedthrough conductors extending through the electrical insulator from a first side to a second side thereof;
• a printed circuit board (PCB) disposed adjacent to the second side of the electrical insulator, the PCB including a plurality of ground layers, and a plurality of vias traversing the ground layers, the vias configured to provide a plurality of electrically conductive paths through the ground layers, wherein the electrically conductive connection element is electrically coupled to the plurality of ground layers through the plurality of vias;
• and
• a plurality of capacitors each having a ground terminal and a conductor terminal, wherein the ground terminal is electrically coupled to the plurality of ground layers through at least one of the plurality of vias, and the conductor terminal is electrically coupled to at least one of the plurality of feedthrough conductors.

A method of making a filtered feedthrough assembly for an implantable medical device, the method comprising:

• providing a PCB having a plurality of ground layers, a plurality of vias extending through the ground layer, and a plurality of capacitors, each of the capacitors having a conductor terminal and a ground terminal electrically coupled to the plurality of ground layers through at least one of the vias;
• coupling an electrical insulator to a ferrule using an electrically conductive connection element;
• disposing a plurality of feedthrough conductors through the electrical insulator and attaching the feedthrough conductors to the electrical insulator;
• coupling the PCB to one or more of the ferrule, the electrical insulator, and the feedthrough conductors;
• electrically coupling each of the feedthrough conductors to the conductor terminal of a respective one of the capacitors;
• and
• electrically coupling the connection element to the plurality of ground layers through the vias.