Mounting block and a mounting assembly that incorporates the mounting block

A mounting assembly for mounting a circuit board and one or more integrated circuit (IC) chips thereon, the mounting assembly comprising:

• a mounting block comprising a bottom surface and a multi-level mounting surface, the multi-level upper surface comprising N mounting surfaces, where N is a positive integer that is greater than or equal to 2, said N mounting surfaces including at least a first-level mounting surface and a second-level mounting surface, the bottom surface being connected to the first-level mounting surface by first side walls of the mounting block, the first-level mounting surface being connected to the second-level mounting surface by second side walls of the mounting block, the first-level mounting surface being a first distance, d1, from the bottom surface in a direction generally normal to the first-level mounting surface and to the bottom surface, the second-level mounting surface being a second distance, d2, from the first-level mounting surface in a direction generally normal to the first-level mounting surface and to the second-level mounting surface;
• at least a first electrical component mounted on the second-level mounting surface;
• and
• a circuit board mounted on the first-level mounting surface, and wherein the first and second distances d1 and d2, respectively, are preselected such that a top surface of the first IC chip is a first preselected distance from a top surface of the circuit board in a direction generally normal to the top surfaces, wherein a bottom surface of the circuit board is in contact with the first-level mounting surface, and wherein the bottom surface of the circuit board is connected to a top surface of the circuit board by side walls of the circuit board, and wherein a cutaway portion of the circuit board forms an opening in the circuit board that is definable by the inside walls of the circuit board, and wherein the inside walls of the circuit board surround the second side walls that connect the first-level mountain surface to the second-level mounting surface, and wherein electrical contact pads of the circuit board are disposed on the top surface of the circuit board adjacent the inside walls of the circuit board, and wherein the electrical contact pads of the first IC chip are disposed on the top surface of the first IC chip about a peripheral portion of the first IC chip that is adjacent the opening formed in the circuit board.