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US 9,521,738 B1Granted
Graphite sheet to protect SMT components from thermal exposure
AssigneeFlextronics AP, LLC
InventorsDennis Willie, Richard Loi, David Geiger, Anwar Mohammed, Murad Kurwa, Hector Rene Marin Hernandez
Life of this patent
Estimating the term…
Abstract
A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.
Claims23
A heat shielding system comprising:
- a. a substrate having a first surface;
- b. an electronic component having a body and one or more electronic leads extending from the body, wherein the electronic component is coupled to the substrate;
- and
- c. a formed graphite sheet positioned over the electronic component and coupled to the first surface of the substrate, wherein the formed graphite sheet is configured to enable a temperature gradient between the body of the electronic component and the one or more electronic leads when external heat is applied to the system, wherein the temperature gradient is enabled such that an electronic lead temperature is at least a first threshold temperature while a body temperature is maintained below a second threshold temperature where the second threshold temperature is less than the first threshold temperature.
1 more element
A heat shielding system comprising:
- a. a printed circuit board having a first surface;
- b. an electronic component having a body and one or more electronic leads extending from the body, wherein the electronic component is mounted to the first surface of the printed circuit board;
- and
- c. a graphite cap positioned over the electronic component and coupled to the first surface of the printed circuit board, wherein the graphite cap comprises a top surface configured to cover the electronic component and a bottom surface surrounding an opening through which the electronic component fits, further wherein the graphite cap is configured to enable a temperature gradient between the body of the electronic component and the one or more electronic leads when external heat is applied to the system such that an electronic lead temperature is at least a first threshold temperature while a body temperature is maintained below a second threshold temperature where the second threshold temperature is less than the first threshold temperature.
1 more element
Dependencies are inferred from the claim text.