US 9,521,737 B2 · Power module

Abstract

In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.

Claims8

Dependent claims

A power module comprising:

a heat dissipation substrate having one surface on which a power semiconductor element is mounted and a substrate tilted part formed at an end portion thereof;
a resin case surrounding said power semiconductor element, the resin case contacting said one surface of said heat dissipation substrate;
a cooling fin contacting an opposite surface of said heat dissipation substrate;
and
a pressure structure contacting said substrate tilted part of said heat dissipation substrate to press said heat dissipation substrate against said cooling fin.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/441,064Filed 20 May 2013

Priority

JP 2012-26000228 Nov 2012

Published

US 2015/0289356 A18 Oct 2015

Granted

13 Dec 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components
H05K 7/2039
Modifications to facilitate cooling, ventilating, or heating: characterised by the heat transfer by conduction from the heat generating element to…
H05K 7/209
For power electronics, e.g. for inverters for controlling motor: heat transfer by conduction from internal heat source to heat radiating structure
H10W 40/255
Characterised by their materials: having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates

Power module

Life of this patent

Power module

Life of this patent

Abstract

Claims8