Multilayer chip electronic component and board having the same

A multilayer chip electronic component comprising:

• a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;
• an inductor part disposed within the ceramic body and including first and fourth internal electrodes exposed to the first and second main surfaces and second and third internal electrodes exposed to the first main surface;
• a capacitor part disposed within the ceramic body and including two fifth internal electrodes exposed to the second main surface and a sixth internal electrode exposed to the second main surface;
• a first connecting electrode disposed within the ceramic body and exposed to the second main surface and the first end surface of the ceramic body and a second connecting electrode disposed within the ceramic body and exposed to the second main surface and the second end surface of the ceramic body;
• and
• first to sixth external electrodes disposed on the first and second main surfaces of the ceramic body and electrically connected to the first to sixth internal electrodes, a first connection terminal disposed on the second main surface and the first end surface of the ceramic body and connected to the first connecting electrode, and a second connection terminal disposed on the second main surface and the second end surface of the ceramic body and connected to the second connecting electrode,
• wherein the capacitor part is composed of first and second capacitor parts, and the inductor part and the capacitor part are connected to each other.