Bonding method, mounting table and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorDaisuke Hayashi
Life of this patent
Estimating the term…
Abstract
A distance between the surface of the base member and the electrostatic chuck having the heater pattern formed on a bottom surface thereof can be uniformized. A bonding method of bonding an electrostatic chuck and a base member to each other includes forming a filling member 30 by covering irregularities of a heater pattern 9a formed on a bottom surface 61 of the electrostatic chuck 9 facing the base member 10; grinding a base member contact surface 62 of the filling member 30 facing the base member 10; and bonding the ground base member contact surface 62 of the filling member 30 to the base member 10 with an adhesive layer 31 provided therebetween.
Claims8
A mounting table, comprising:
- a base member having a peripheral protruding portion formed at a periphery of the base member such that the peripheral protruding portion is higher than a central portion of the base member;
- an electrostatic chuck provided on the central portion of the base member;
- a heater pattern formed on a bottom surface of the electrostatic chuck facing the base member;
- a filling member that covers irregularities of the heater pattern and has a ground base member contact surface facing the base member;
- an adhesive layer that bonds the base member contact surface of the filling member and the base member to each other;
- and
- a sealing member provided at an outer peripheral portion of the filling member and the adhesive layer, and is in contact with a side surface of the peripheral protruding portion of the base member.
A bonding method of bonding an electrostatic chuck and a base member to each other, the bonding method comprising:
- forming a filling member by covering irregularities of a heater pattern formed on a bottom surface of the electrostatic chuck facing the base member;
- grinding a base member contact surface of the filling member facing the base member;
- and
- bonding the ground base member contact surface of the filling member to the base member with an adhesive layer provided therebetween,
- wherein the base member has a peripheral protruding portion formed at a periphery of the base member such that the peripheral protruding portion is higher than a central portion of the base member on which the electrostatic chuck is provided, and
- a sealing member is provided at an outer peripheral portion of the filling member and the adhesive layer, and is in contact with a side surface of the peripheral protruding portion of the base member.
A substrate processing apparatus, comprising:
- a mounting table including:
- a base member having a peripheral protruding portion formed at a periphery of the base member such that the peripheral protruding portion is higher than a central portion of the base member;
- an electrostatic chuck provided on the central portion of the base member;
- a heater pattern formed on a bottom surface of the electrostatic chuck facing the base member;
- a filling member that covers irregularities of the heater pattern and has a ground base member contact surface facing the base member;
- an adhesive layer that bonds the base member contact surface of the filling member and the base member to each other;
- and
- a sealing member provided at an outer peripheral portion of the filling member and the adhesive layer, and is in contact with a side surface of the peripheral protruding portion of the base member.
Dependencies are inferred from the claim text.