RF system-in-package with microstrip-to-waveguide transition

A method of fabricating an antenna apparatus, the method comprising:

• fabricating an integrated circuit (IC) package, the IC package comprising:
• a substrate comprising a first metal layer proximate to first surface of the substrate, a second metal layer proximate to a second surface of the substrate opposite the first surface, and a dielectric layer disposed between the first and second metal layers;
• an IC die disposed at the first surface of the substrate, the IC die comprising radio frequency (RF) circuitry;
• the first metal layer comprising:
• a first microstrip feedline proximate to the first surface and extending from a first pin of the IC die, the first microstrip feedline comprising a first conductive trace having a first probe element at a tip distal from the first pin;
• and
• a first waveguide opening comprising a first region surrounding the first probe element, the first region being substantially devoid of conductive material;
• the second metal layer comprising a ground plane proximate to the second surface of the substrate and disposed in a plane parallel to the first metal layer and separate from the first metal layer in a first direction;
• and
• the substrate further comprising a first plurality of metal vias disposed at the perimeter of the first region and extending from the first metal layer to the ground plane;
• and
• mounting a waveguide interface assembly adjacent to the first surface of the substrate, the waveguide interface assembly comprising:
• an internal cavity in which the IC package is disposed;
• and
• a waveguide channel extending from the internal cavity to an external surface of the waveguide interface assembly, the waveguide channel having an opening to the internal cavity that is aligned with the first waveguide opening and that is proximate to the first metal layer, wherein the waveguide channel has a proximal end proximate to the first microstrip feedline and has a distal end that extends in a second direction opposite the first direction.

A method comprising:

• providing an integrated circuit (IC) package comprising:
• a substrate comprising a first metal layer proximate to a first surface of the substrate, a second metal layer proximate to a second surface of the substrate opposite the first surface, and a dielectric layer disposed between the first and second metal layers;
• an IC die disposed at the substrate, the IC die comprising radio frequency (RF) circuitry;
• the first metal layer comprising:
• a first microstrip feedline proximate to the first surface and extending from a first pin of the IC die, the first microstrip feedline comprising a first conductive trace having a first probe element at a tip distal from the first pin;
• a first waveguide opening comprising a first region surrounding the first probe element, the first region being substantially devoid of conductive material;
• a second microstrip feedline proximate to the first surface and extending from a second pin on a side of the IC die opposite the first pin, and the second microstrip feedline comprising a second conductive trace having a second probe element at a tip distal from the second pin;
• and
• a second waveguide opening comprising a second region surrounding the second probe element, the second region being substantially devoid of conductive material;
• and
• the second metal layer comprising a ground plane proximate to the second surface and disposed in a plane parallel to the first metal layer and separated from the first metal layer in a first direction;
• configuring the IC die to transmit RF signaling via the first microstrip feedline in a first mode;
• configuring the IC die to receive RF signaling via the second microstrip feedline in a second mode;
• and
• providing a waveguide interface assembly disposed adjacent to the first surface of the substrate, the waveguide interface assembly comprising:
• an internal cavity in which the IC package is disposed;
• and
• a waveguide channel extending from the internal cavity to an external surface of the waveguide interface assembly, the waveguide channel having an opening to the internal cavity that is aligned with the first waveguide opening and proximate to the first metal layer, and having a proximal end proximate to the first microstrip feedline and a distal end that extends in a second direction opposite the first direction.