Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode

A light emitting diode comprising:

• a first conductive-type semiconductor layer;
• a mesa placed on the first conductive-type semiconductor layer, the mesa including an active layer and a second conductive-type semiconductor layer;
• a reflective electrode structure placed on the mess;
• a current spreading layer covering the mesa and the first conductive-type semiconductor layer, and including an opening placed in an upper region of the mesa while exposing the reflective electrode structure, the current spreading layer forming ohmic contact with the first conductive-type semiconductor layer and being insulated from the mesa;
• a lower insulation layer placed between the mesa and the current spreading layer and insulating the current spreading layer from the mesa, the lower insulation layer including an opening placed in the upper region of the mesa and exposing the reflective electrode structure;
• an upper insulation layer covering at least part of the current spreading layer and including an opening on the reflective electrode structure,
• wherein the opening of the upper insulation layer is narrower than the opening of the lower insulation layer.