Optoelectronic component and method for the production thereof
AssigneeOSRAM Opto Semiconductor GmbH
InventorsMartin Brandl, Michael Zitzlsperger
Life of this patent
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Abstract
An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.
Claims16
An optoelectronic component comprising:
- a plastics housing,
- wherein a first leadframe section is embedded into the plastics housing,
- a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing,
- the soldering contact face has a groove,
- the groove is not covered by the material of the plastics housing, and
- the groove extends circumferentially around a central region of the soldering contact face at least in sections.
The optoelectronic component as claimed in 1, wherein the groove has a depth of 10 μm to 1 mm.
The optoelectronic component as claimed in 1, wherein an optoelectronic semiconductor chip is arranged on the chip landing face.
The optoelectronic component as claimed in 1,
- wherein the plastics housing has a cavity adjoining the chip landing face, and
- a potting material is arranged in the cavity.
The optoelectronic component as claimed in 5, wherein the potting material comprises silicone.
The optoelectronic component as claimed in 1,
- wherein a second leadframe section is embedded into the plastics housing, and
- an upper face and a lower face of the second leadframe section are at least partly not covered by the plastics housing.
An optoelectronic component comprising:
- a plastics housing,
- wherein a first leadframe section is embedded into the plastics housing,
- a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing,
- the soldering contact face has a groove,
- the groove is not covered by the material of the plastics housing,
- the plastics housing has a cavity adjoining the chip landing face,
- a potting material is arranged in the cavity,
- the groove extends circumferentially around a central region of the soldering contact face at least in sections, and
- the groove prevents wetting of the central region by the potting material.
The optoelectronic component as claimed in 9, wherein the groove has a depth of 10 μm to 1 mm.
The optoelectronic component as claimed in 9, wherein an optoelectronic semiconductor chip is arranged on the chip landing face.
The optoelectronic component as claimed in 9,
- wherein the plastics housing has a cavity adjoining the chip landing face, and
- a potting material is arranged in the cavity.
The optoelectronic component as claimed in 13, wherein the potting material comprises silicone.
The optoelectronic component as claimed in 9,
- wherein a second leadframe section is embedded into the plastics housing, and
- an upper face and a lower face of the second leadframe section are at least partly not covered by the plastics housing.
Dependencies are inferred from the claim text.