Light emitting diode, method of fabricating the same and LED module having the same

A light emitting diode (LED) module comprising:

• a printed circuit board;
• and a light emitting diode bonded to an upper side of the printed circuit board, the light emitting diode comprising:
• a first conductive-type semiconductor layer;
• a mesa placed on the first conductive-type semiconductor layer and including an active layer and a second conductive-type semiconductor layer;
• a reflective electrode structure disposed on the mesa;
• a current spreading layer covering the mesa and the first conductive-type semiconductor layer, and having an opening exposing the reflective electrode structure, the current spreading layer being electrically connected to the first conductive-type semiconductor layer while being insulated from the reflective electrode structure and the mesa;
• and an upper insulation layer covering the current spreading layer, the upper insulation layer having a first opening exposing the current spreading layer to define a first electrode pad region, and a second opening exposing an exposed upper region of the reflective electrode structure to define a second electrode pad region, wherein the first electrode pad region and the second electrode pad region are bonded to corresponding pads on the printed circuit boards via solder pastes, respectively.