US 9,520,453 B2 · Electroluminescent device and manufacturing method thereof

Abstract

An electroluminescent device and manufacturing method thereof are provided. The electroluminescence device comprises an array substrate (10). The array substrate (10) comprises a substrate (11); and a thin film transistor (12), a protection layer (13) and a connection electrode (14) provided in turn on the substrate (11). The protection layer (13) covers the thin film transistor (12); and the connection electrode (14) is provided on the protection layer (13). The protection layer (13) below the connection electrode (14) protrudes towards a side away from the substrate (11) to form a boss (131). The protection layer (13) comprises a via hole (132) provided at a position corresponding to a drain electrode (122) of the thin film transistor (12). The connection electrode (14) is connected with the drain electrode (122) of the thin film transistor (12) through the via hole (132). The electroluminescent device and manufacturing method thereof shorten the film formation time, reduce the etching difficulty and accordingly improves the production efficiency in the process of manufacturing the connection electrode while the reliability of electrical connection between a thin film transistor and a second electrode is improved.

Claims19

Dependent claims

An electroluminescent device, comprising an array substrate;

wherein the array substrate comprises a substrate, and a thin film transistor, a protection layer and a connection electrode provided in turn on the substrate;
the protection layer covers the thin film transistor;
the connection electrode is provided on the protection layer;
and
the protection layer below the connection electrode protrudes towards a side away from the substrate to form a boss, the boss being higher than other parts of the protection layer not under the connection electrode;
the protection layer comprises a via hole provided in a position corresponding to a drain electrode of the thin film transistor;
and the connection electrode connects with the drain electrode of the thin film transistor through the via hole.

4 more elements

A method of manufacturing an electroluminescent device, comprising a step of preparing a color film substrate, a step of preparing an array substrate, a step of assembling the color film substrate and the array substrate;

wherein the step of preparing the array substrate comprises:
forming a thin film transistor on a substrate;
forming a protection layer on the substrate with the thin film transistor;
forming a boss at a preset position, at which a connection electrode is formed subsequently, by a pattern process and forming a via hole at a position of the protection layer corresponding to a drain electrode of the thin film transistor, to allow the boss being higher than other parts of the protection layer not under the connection electrode;
and
forming the connection electrode on the protection layer;
wherein the connection electrode is connected with the drain electrode of the thin film transistor through the via hole of the protection layer.

4 more elements

Dependencies are inferred from the claim text.

Electroluminescent device and manufacturing method thereof

Life of this patent

Electroluminescent device and manufacturing method thereof

Life of this patent

Abstract

Claims19