Flexible APS X-ray imager with MOTFT pixel readout and a pin diode sensing element

A method of fabricating an X-ray imager comprising the steps of:

• providing a glass substrate with a surface;
• forming an etch stop layer including one of a noble metal and poly-Si on the surface of the glass substrate;
• depositing a stack of elemental or compound semiconductor layers on the etch stop layer, the stack including a first p or n doped layer, an intrinsic layer, and a second n or p doped layer, forming a PIN photodiode plane;
• separating the stack of semiconductor layers into an array of PIN photodiodes;
• depositing a layer of insulating material on the array of sensing elements to form a planarized surface and forming vias through the planarizing layer into communication with an upper surface of each PIN photodiode in the array of PIN photodiodes;
• forming metal contacts on the planarized surface and through the vias in contact with the upper surface of each PIN photodiode in the array of PIN photodiodes;
• fabricating an array of MOTFTs in an active pixel sensor configuration backplane on the planarized surface and in electrical communication with the contacts, to provide a sensor plane/MOTFT backplane interconnected combination;
• attaching a flexible support carrier to the MOTFT backplane;
• removing the glass substrate;
• and
• laminating a scintillator on the array of PIN photodiodes.