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US 9,520,434 B2Granted
Image pickup module
AssigneeOlympus Corporation
InventorMasashi Yamada
Life of this patent
Estimating the term…
Abstract
An image pickup module includes: an image pickup chip including a main surface on which a light-receiving portion of an image pickup device and a plurality of electrodes connected to the light-receiving portion are formed; and a wiring board including flying leads bonded to the respective plurality of electrodes.
Claims7
An image pickup module comprising:
- an image pickup chip including a main surface on which a light-receiving portion of an image pickup device and a plurality of electrodes connected to the light-receiving portion are formed;
- a wiring board including flying leads bonded to the respective plurality of electrodes;
- and
- a sealing portion that seals the flying leads;
- wherein an electronic component is surface-mounted on the wiring board,
- the sealing portion is formed by curing a liquid resin disposed between the optical component and the electronic component;
- and
- the sealing portion is in contact with the electronic component.
5 more elements
Dependencies are inferred from the claim text.