Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer

A method of manufacturing a package-on-package device, comprising:

• forming a lower package including at least a first lower semiconductor chip stacked on a lower package substrate, and a lower molding layer surrounding lateral sides of the first lower semiconductor chip;
• forming a plurality of openings in the lower molding layer;
• forming a plurality of first conductors in the plurality of openings, respectively;
• forming an upper package including at least a first upper semiconductor chip stacked on an upper package substrate, and an upper molding layer surrounding lateral sides of the first upper semiconductor chip;
• stacking the upper package on the lower package to form a stacked package, such that a plurality of connecting conductors that include the plurality of first conductors, respectively, are disposed between the upper package substrate and the lower package substrate, the plurality of connecting conductors disposed in a region surrounding the lateral sides of the first lower semiconductor chip, and wherein each connecting conductor of the plurality of connecting conductors extends at least from a top surface of the lower package substrate to a bottom surface of the upper package substrate to physically and electrically connect the upper package to the lower package;
• wherein an insulation layer is disposed to laterally surround the region in which the plurality of connecting conductors are disposed, the insulation layer formed between the lower molding layer and the upper package substrate, and being exposed to an outside of the stacked package;
• and
• forming an electromagnetic shielding layer to surround lateral and top surfaces of the stacked package,
• wherein the plurality of connecting conductors include a set of outer-most connecting conductors and a set of inner connecting conductors, the two sets comprising all of the plurality of connecting conductors between the lower package substrate and the upper package substrate, and the insulation layer contacts at least some of the outer-most connecting conductors and does not contact any of the inner connecting conductors, and
• wherein the insulation layer forms a plug that prevents material used for the shielding layer from contacting the plurality of connecting conductors.