Light source unit and backlight assembly having the same
AssigneeSamsung Display Co., Ltd.
InventorsSi Joon Song, Hyuk Hwan Kim, Seok Hyun Nam, Byoung Dae Ye, Young Keun Lee
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AssigneeSamsung Display Co., Ltd.
InventorsSi Joon Song, Hyuk Hwan Kim, Seok Hyun Nam, Byoung Dae Ye, Young Keun Lee
Estimating the term…
A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.
A light source unit comprising:
Dependencies are inferred from the claim text.