Light emitting device package and lighting system

A light emitting device package, comprising:

• a body including a cavity having an open upper portion;
• first and second lead frames in the cavity of the body;
• a first light emitting diode on the first lead frame;
• a second light emitting diode on the first lead frame, the second light emitting diode spaced apart from the first light emitting diode with a first distance;
• an adhesive agent adhered between the first, second and third light emitting diodes and the first lead frame;
• and
• a molding member covering the first and second light emitting diodes,
• wherein the first lead frame and the second lead frame are electrically connected to the first and second light emitting diodes,
• wherein the molding member is contacted with the plurality of light emitting diodes,
• wherein the first and second light emitting diodes include one of a blue LED chip, a green LED chip, a red LED chip and a UV LED chip,
• wherein the first light emitting diode has a first side having a first length and a second side having a second length shorter than the first length of the first side, and
• wherein the first distance is a range of 200 μm to 300 μm and has a range of A1/4 to A1, wherein A1 is the second length of the second side of the first light emitting diode,
• wherein the first lead frame has a thickness of range of about 0.1 mm to 0.5 mm,
• wherein the light emitting diodes on the first lead frame are three or less,
• wherein the first distance between the first light emitting diode and the second light emitting diode decreases mutual interference by heat generated from the first and second light emitting diodes, and
• wherein the first distance is a distance representing a temperature characteristic of heat emitted from the first and second light emitting diodes that is substantially identical to a thermal characteristic of heat emitted from one of the first light emitting diode and the second light emitting diode.

A light emitting device package, comprising:

• a body;
• a first lead frame on the body;
• a second lead frame spaced apart from the first lead frame on the body;
• a plurality of light emitting diodes on the first lead frame;
• an adhesive agent adhered between each of the plurality of light emitting diodes and the first lead frame;
• and
• a molding member on the plurality of light emitting diodes,
• wherein the plurality of light emitting diodes includes a first light emitting diode, a second light emitting diode and a third light emitting diode arranged in at least two rows,
• wherein the first, second and third light emitting diodes are spaced apart from each other,
• wherein the first and second light emitting diodes are disposed in a first row on the first lead frame,
• wherein the third light emitting diode is disposed in a second row spaced apart from the first row on the first lead frame,
• wherein a first distance between the first light emitting diode and the second light emitting diode has a range of A1/4 to A1, wherein A1 is a length of a first side of the first light emitting diode,
• wherein a second distance between the first light emitting diode and the third light emitting diode is a same or different distance from the first distance,
• wherein the first distance is a range of 250 μm±50 μm,
• wherein the second distance is a range of 250 μm±50 μm,
• wherein a third distance between the third light emitting diode and the second light emitting diode is about 250 μM±50 μm,
• wherein the first lead frame and the second lead frame are electrically connected to the plurality of the light emitting diodes,
• wherein the molding member contacts the plurality of light emitting diodes,
• wherein the plurality of light emitting diodes include one of a blue LED chip, a green LED chip, a red LED chip and an UV LED chip, and
• wherein A1 is a length of a short side of sides of the first light emitting diode,
• wherein all of the light emitting diodes emit a light of the same color,
• wherein the first lead frame has a thickness of range of about 0.1 mm to 0.5 mm,
• wherein the body is formed of one of a silicon material, a ceramic material, and a resin material,
• wherein the body includes an upper portion thereof with a cavity having an open upper portion, and the first lead frame, the plurality of light emitting diodes, and the molding member are in the cavity,
• wherein the light emitting diodes on the first lead frame are three or less,
• wherein the first distance between the first light emitting diode and the second light emitting diode decreases mutual interference by heat generated from the first and second light emitting diodes, and
• wherein the first distance is a distance representing a temperature characteristic of heat emitted from the first and second light emitting diodes that is substantially identical to a thermal characteristic of heat emitted from one of the first light emitting diode and the second light emitting diode.