Semiconductor device for use in flip-chip bonding, which reduces lateral displacement

A semiconductor device comprising:

• a multilayer chip including a first semiconductor chip and a second semiconductor chip that are bonded together, wherein
• a first electrode pad is provided on a principal surface of the first semiconductor chip,
• a first bump is provided on the first electrode pad,
• a second bump is provided on a principal surface of the second semiconductor chip and is bonded to the first bump,
• the first electrode pad has an opening extending through the first electrode pad, the opening formed by removing a center portion of the first electrode pad,
• the opening and an entire peripheral portion of the opening form a stepped shape, and
• the first bump having a recessed portion that is recessed at a center thereof, in plan view immediately above the opening of the first electrode pad, the recessed portion covers the stepped shape, and the recessed portion conforms to a flat portion of the first electrode pad.