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US 9,520,378 B2Granted
Thermal matched composite die
AssigneeIntel Corporation
InventorsAleksandar Aleksov, Shawna M. Liff
Life of this patent
Estimating the term…
Abstract
A thermal matched composite material, suitable for use as a die is described. In one example, the material includes a metal plate and a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits. An adhesive layer between the substrate and the metal plate physically attaches the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone.
Claims20
An apparatus comprising:
- a metal plate;
- a semiconductor die configured to carry microelectronic circuits and connectors formed on a back end of substrate, the substrate having a linear coefficient of thermal expansion (CTE) lower than the metal plate;
- and
- an adhesive layer on the front end of the substrate opposite the back end between the substrate and the metal plate to physically attach and mechanically couple the metal plate to the substrate so that the combined metal plate and substrate form a composite that has a higher CTE than the substrate alone, the adhesive layer having a first sub-layer proximate the substrate and a second sub-layer proximate the metal, the first and second sub-layers being gradated structures.
1 more element
An apparatus comprising:
- a communications chip;
- a mass memory;
- and
- a processor formed on a packaged die, the packaged die having a metal plate, a semiconductor die configured to carry microelectronic circuits and connectors formed on a back end of a substrate having a linear coefficient of thermal expansion (CTE) lower than the metal plate, and an adhesive layer on the front end of the substrate opposite the back end between the substrate and the metal plate to physically attach and mechanically couple the metal plate to the substrate so that the combined metal plate and substrate form a composite that has a higher CTE than the substrate alone, the adhesive layer having a first sub-layer proximate the substrate with a higher amount of zirconia than a second sub-layer proximate the metal that has more epoxy than the first sub-layer, the first and second sub-layers being gradated structures.
1 more element
An apparatus comprising:
- a communications chip;
- a mass memory;
- and
- a processor formed on a packaged die, the packaged die having a metal plate, a semiconductor die comprising microelectronic circuits and connectors formed on a back end of a substrate, the substrate having a linear coefficient of thermal expansion (CTE) lower than the metal plate, and an adhesive layer on the front end of the substrate opposite the back end between the substrate and the metal plate to physically attach and mechanically couple the metal plate to the substrate so that the combined metal plate and substrate form a composite that has a higher CTE than the substrate alone, the adhesive layer having a first sub-layer proximate the substrate with a higher layer of zirconia than a second sub-layer proximate the metal that has more epoxy than the first sub-layer, the first and second sub-layers being gradated structures.
1 more element
Dependencies are inferred from the claim text.