Semiconductor device, substrate and semiconductor device manufacturing method

A semiconductor device including a BGA (Ball Grid Array) configuration, comprising:

• a semiconductor chip;
• a conductive layer disposed at a back surface of the semiconductor chip;
• an interposer disposed on a lower side of the conductive layer to support the semiconductor chip;
• an internal terminal formed on the interposer;
• a sealing resin to seal the semiconductor chip and a surface portion of the interposer;
• and
• a plurality of external terminals formed in a ball shape on an opposite surface of the interposer from a surface of the interposer on which the conductive layer is provided,
• wherein the conductive layer includes:
• a first portion disposed such that an outer periphery thereof is inside an outer periphery of the semiconductor chip as seen from above;
• and
• a second portion extending outward from a part of the outer periphery of the first portion, wherein an end part thereof extends toward a corner of the semiconductor chip as seen from above,
• wherein at least one of a plurality of sides of the semiconductor chip has an edge that faces a corresponding edge of the first portion of the conductive layer and is spaced apart from the corresponding edge by a substantially uniform distance,
• wherein a surface of the second portion of the conductive layer and a surface of the internal terminal are in the same plane,
• wherein the second portion of the conductive layer is disposed in the sealing resin and the end part thereof is covered by the sealing resin,
• wherein the end part of the second portion is disposed adjacent to the corner of the semiconductor chip as viewed from above, and
• wherein the plurality of external terminals are disposed in a grid-like arrangement.