Semiconductor package

A semiconductor package comprising:

• a semiconductor chip comprising a first region in which a power pad and a ground pad are disposed and a second region in which a signal pad is disposed;
• and
• a redistribution structure disposed on the first and second regions of the semiconductor chip,
• wherein the redistribution structure comprises:
• at least one redistribution layer connected to the chip pads;
• and
• at least one redistribution insulating layer disposed between the at least one redistribution layer and the semiconductor chip,
• wherein the at least one redistribution insulating layer comprises a first insulating portion having a first dielectric constant and a second insulating portion having a second dielectric constant that is lower than the first dielectric constant, and
• the first insulating portion overlaps the first region of the semiconductor chip, and the second insulating portion overlaps the second region of the semiconductor chip.

A semiconductor package comprising:

• a printed circuit board (PCB);
• and
• a semiconductor chip mounted on the PCB,
• wherein the PCB comprises:
• a body resin having a top surface and a bottom surface;
• and
• an interconnection pattern formed on at least one of the top surface and the bottom surface of the body resin,
• wherein the body resin comprises a first body portion having a first dielectric constant and a second body portion having a second dielectric constant that is different from the first dielectric constant.