Back to results
US 9,520,369 B2Granted
Power module and method of packaging the same
AssigneeHyundai Mobis Co., Ltd.
InventorJae Hyun Ko
Life of this patent
Estimating the term…
Abstract
Provided are a power module having an integrated power semiconductor and a method of packaging the same. The power module according to an aspect of the present invention includes a power semiconductor chip based on silicon and insulating substrates respectively disposed at both surfaces of the power semiconductor chip and including a metal pattern electrically and directly connected to the power semiconductor chip.
Claims14
A power module comprising:
- a power semiconductor chip based on silicon;
- an upper insulating substrate disposed on an upper surface of the power semiconductor chip;
- a pattern formed on a first surface of the upper insulating substrate, the pattern being electrically and directly connected to the power semiconductor chip;
- and
- a dielectric layer formed on a second surface of the upper insulating substrate, the second surface being opposite of the first surface.
2 more elements
A method of packaging a power module, comprising:
- forming a pattern on a first surface of an upper insulating substrate;
- disposing a power semiconductor chip based on silicon under the upper insulating substrate;
- disposing and bonding a lower insulating substrate under the power semiconductor chip;
- and
- forming a dielectric layer on a second surface of the upper insulating substrate opposite the first surface.
2 more elements
A power module comprising:
- a power semiconductor chip based on silicon;
- an upper insulating substrate disposed on an upper surface of the power semiconductor chip;
- a pattern formed on a first surface of the upper insulating substrate, the pattern being electrically and directly connected to the power semiconductor chip;
- a dielectric layer formed on a second surface of the upper insulating substrate, the second surface being opposite of the first surface;
- a heat sink layer configured to cover the second surface;
- and
- a heat sink attached to the heat sink layer using solder.
4 more elements
Dependencies are inferred from the claim text.