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US 9,520,356 B1Granted
Circuit with reduced noise and controlled frequency
AssigneeAnalog Devices, Inc.
InventorsJohn A. Chiesa, Cemin Zhang, Byungmoo Min, Ekrem Oran, John N. Poelker
Life of this patent
Estimating the term…
Abstract
A die is packaged by flip-chip mounting the die with the active side facing a low loss substrate. A ground plane is coupled to the active side of the die by vias through the low loss substrate. The ground plane is positioned to concentrate high frequency electromagnetic fields in the low loss substrate. A tuning height can be adjusted to tune the center frequency of a circuit in the die.
Claims20
A packaged chip comprising:
- a packaging substrate comprising a first side and a second side, the second side opposing the first side;
- a die comprising:
- a semiconductor substrate that is more lossy than the packaging substrate;
- and
- a resonator circuit comprising microstrip lines, on an active side of the die, the active side facing the first side of the packaging substrate;
- and
- a ground plane that is external to the die, the ground plane being separated from the resonator circuit by at least a portion of the packaging substrate, and the ground plane being electrically coupled to the die.
4 more elements
An electronic system comprising:
- a resonator circuit on an active side of a microwave monolithic integrated circuit (MMIC) that comprises a semiconductor substrate;
- a packaging substrate that is less lossy than the semiconductor substrate;
- and
- a ground plane;
- wherein a positioning of the ground plane relative to the resonator circuit is configured to concentrate microwave frequency electromagnetic fields more in at least a portion of the packaging substrate than in the semiconductor substrate.
2 more elements
A chip assembly method comprising:
- providing a die comprising a resonator;
- and
- flip chip mounting the die on a packaging substrate such that an active side of the die is electrically coupled to a ground plane external to the die by way of a via in the packaging substrate, wherein the packaging substrate has a lower loss than a semiconductor substrate of the die, wherein a distance from the ground plane to the resonator impacts a center frequency of the resonator, and wherein the ground plane is the nearest ground plane to the resonator.
Dependencies are inferred from the claim text.