Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module

A semiconductor module comprising:

• a semiconductor chip having a front surface and a rear surface, the semiconductor chip being provided with a vertical-type semiconductor power element, the semiconductor chip having a signal line electrode and a front surface electrode on the front surface, and a rear surface electrode on the rear surface;
• a first lead frame being connected to the rear surface electrode of the semiconductor chip, and including a first terminal;
• a second lead frame including a signal line terminal connected to the signal line electrode of the semiconductor chip, and a plate portion that is connected to the front surface electrode of the semiconductor chip, and from which a second terminal extends;
• a first heat radiation substrate being joined to a surface of the first lead frame opposite to a surface on which the semiconductor chip is disposed;
• a second heat radiation substrate being joined to a surface of the second lead frame opposite to a surface on which the semiconductor chip is disposed;
• and
• a resin part, wherein the semiconductor chip, the first lead frame the second lead frame, the first heat radiation substrate and the second heat radiation substrate are sealed by the resin part such that the first terminal and the second terminal are exposed from the resin part and a surface of the first heat radiation substrate opposite to a surface joined to the first lead frame and a surface of the second heat radiation substrate opposite to a surface joined to the second lead frame are exposed from the resin part, wherein
• each of the first heat radiation substrate and the second heat radiation substrate includes a first conductive portion, a second conductive portion and an insulated substrate, the first conductive portion providing the surface joined to corresponding one of the first lead frame and the second lead frame, the second conductive portion providing the surface exposed from the resin part, the insulated substrate being disposed between the first conductive portion and the second conductive portion,
• each of the first conductive portion and the second conductive portion has a solid shape without being divided,
• the first conductive portion and the second conductive portion have a symmetric shape,
• the first lead frame and the first heat radiation substrate are disposed on one side of the semiconductor chip to provide a component structure,
• the second lead frame and the second heat radiation substrate are disposed on the other side of the semiconductor chip to provide a component structure,
• the component structure of the one side of the semiconductor chip and the component structure of the other side of the semiconductor chip are symmetric with respect to the semiconductor chip, and
• the signal line terminal and the signal line electrode are joined to each other through a joining material having a bump.