Power management applications of interconnect substrates

A package, comprising:

• a device including one or more power devices configured as part of a switching regulator, the switching regulator having a power node terminal and a switching terminal;
• and
• a premolded interconnect substrate for connecting the device to an assembly, the premolded interconnect substrate including a plurality of electrically conductive structures, a first subset of the electrically conductive structures corresponding to the power node terminal, a second subset of the electrically conductive structures corresponding to the switching terminal;
• wherein the device is mounted on exposed portions of the electrically conductive structures adjacent a first surface of the interconnect substrate via conductive bumps thereby connecting the first subset of the electrically conductive structures to the power node terminal and the second subset of the electrically conductive structures to the switching terminal, and wherein exposed portions of the first and second subsets of the electrically conductive structures at a second surface of the interconnect substrate that is opposite the first surface of the interconnect substrate are configured for connection to first and second conductive planes of the assembly, respectively, such that connections between the first subset of electrically conductive structures and the first conductive plane are made along a portion of the second surface of the interconnect substrate proximate a first edge of the interconnect substrate, and connections between the second subset of electrically conductive structures and the second conductive plane are made along a second portion of the second surface proximate a second edge of the interconnect substrate opposing the first edge.