US 9,520,340 B2 · Semiconductor die connection system and method

Abstract

A system and method for connecting semiconductor dies is provided. An embodiment comprises connecting a first semiconductor die with a first width to a second semiconductor die with a larger second width and that is still connected to a semiconductor wafer. The first semiconductor die is encapsulated after it is connected, and the encapsulant and first semiconductor die are thinned to expose a through substrate via within the first semiconductor die. The second semiconductor die is singulated from the semiconductor wafer, and the combined first semiconductor die and second semiconductor die are then connected to another substrate.

Claims20

Dependent claims

A semiconductor device comprising:

a first die with a first width having a first side and a second side opposite to the first side;
a through substrate via formed in the first die, wherein an edge of the through substrate via is exposed at the second side of the first die;
a second die with a second width having a first side and a second side, wherein the first side of the second die is bonded to the first side of the first die, and the second width is larger than the first width;
and
an encapsulant extending between a sidewall of first die and a surface of the first side of second die.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/875,499Filed 5 Oct 2015 · continuation

Priority

9 Jan 2012

Published

US 2016/0027719 A128 Jan 2016

Granted

13 Dec 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification31 codes

H10P 54/00
Cutting or separating of wafers, substrates or parts of devices
H10P 58/00
Singulating wafers or substrates into multiple chips, i.e. dicing
H10W 20/023
Of interconnections within wafers or substrates: the interconnections being through-semiconductor vias
H10W 20/20
Interconnections in chips, wafers or substrates: interconnections within wafers or substrates, e.g. through-silicon vias [TSV]

Family

Application13/346,398Parent of this continuation · filed 9 Jan 2012

Application13/947,953Parent of this continuation · filed 22 Jul 2013

US 8,518,796 B2Parent of this continuation · filed 27 Aug 2013

US 2016/0027719 A1Pre-grant publication · published 28 Jan 2016

US 9,153,540 B2Parent of this continuation

US 2013/0175700 A1Published application

US 2013/0299976 A1Published application

US 9,520,340 B2This patent

From the US filing history. Foreign family members aren’t listed.

Semiconductor die connection system and method

Life of this patent

Semiconductor die connection system and method

Life of this patent

Abstract

Claims20