Hybrid assembly with improved thermal performance

A method of improving the thermal performance of a hybrid assembly, comprising:

• forming a hybrid assembly, comprising:
• a first die;
• a second die;
• and
• indium bonds which bond and electrically interconnect a top of said first die to a top of said second die, where the first die is mounted on top of the second die, a side of said second die opposite said first die being a bottom side of said hybrid assembly;
• providing a heat sink plate on which said hybrid assembly is to be mounted;
• depositing a plurality of indium bumps on said heat sink plate where said hybrid assembly is to be mounted;
• and
• pressing the bottom side of said hybrid assembly onto the indium bumps so as to affix said hybrid assembly to said heat sink;
• wherein said first die comprises GaSb or mercury cadmium telluride and said second die comprises silicon, said heat sink constraining the lateral coefficient of thermal expansion (CTE) of said silicon such that the CTE of said first die and the CTE of said second die match more closely than they would if the bottom side of said hybrid assembly was mounted on a silicon heat sink plate;
• and
• wherein said second die comprises a read-in IC (RIIC) and said first die comprises an array of LEDs.

A method of improving the thermal performance of a hybrid assembly, comprising:

• forming a hybrid assembly, comprising:
• a first die;
• a second die;
• and
• indium bonds which bond and electrically interconnect a top of said first die to a top of said second die, where the first die is mounted on top of the second die, a side of said second die opposite said first die being a bottom side of said hybrid assembly;
• providing a heat sink plate on which said hybrid assembly is to be mounted;
• depositing a plurality of indium bumps on said heat sink plate where said hybrid assembly is to be mounted;
• and
• pressing the bottom side of said hybrid assembly onto the indium bumps so as to affix said hybrid assembly to said heat sink plate;
• wherein a back side of said heat sink plate is in direct contact with a cryogenic coolant and said hybrid assembly and coolant are within a dewar.