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US 9,520,334 B2Granted
Integrated structure with improved heat dissipation
AssigneesSTMicroelectronics (Crolles 2) SAS, STMicroelectronics S.r.l.
InventorsLaurent-Luc Chapelon, Pascal Ancey, Sandrine Lhostis
Life of this patent
Estimating the term…
Abstract
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.
Claims27
An integrated structure, comprising:
- integrated circuit chip having a semiconductor substrate;
- and
- a heat dissipating housing attached to the integrated circuit chip, the heat dissipating housing comprising a body, the body formed of a semiconductor material that is thermally conductive and has a thermal expansion compatible with the semiconductor substrate.
An integrated structure, comprising:
- an integrated circuit chip including a semiconductor substrate having a front side with an interconnection network and a back side with a formed cavity;
- and
- a heat dissipating structure attached to the integrated circuit chip within said cavity on the back side, the heat dissipating structure being thermally conductive and having a thermal expansion compatible with the semiconductor substrate.
An integrated structure, comprising:
- an integrated circuit chip having a front side with an interconnection network and a back side;
- a heat dissipating structure attached to the interconnection network on the front side of the integrated circuit chip, the heat dissipating structure being thermally conductive and having a thermal expansion compatible with the integrated circuit chip;
- and
- wherein the heat dissipating structure comprises a body made of a semiconductor material possessing at least one cavity closed by a cover.
1 more element
An integrated structure, comprising:
- an integrated circuit chip having a front side with an interconnection network and a back side;
- a heat dissipating structure attached to the interconnection network on the front side of the integrated circuit chip, the heat dissipating structure being thermally conductive and having a thermal expansion compatible with the integrated circuit chip;
- and
- wherein the heat dissipating structure comprises a body made of silicon possessing at least one cavity closed by a cover made of silicon, said at least one cavity containing a phase-change material.
1 more element
An integrated structure, comprising:
- a substrate supporting at least one integrated circuit chip;
- and
- a heat dissipating housing attached to the integrated circuit chip, the heat dissipating housing being thermally conductive and having a thermal expansion compatible with the integrated circuit chip;
- wherein the heat dissipating housing comprises a body made of silicon possessing at least one cavity closed by a cover made of silicon and containing the phase-change material.
1 more element
An integrated structure, comprising:
- an integrated circuit chip having a front side with an interconnection network and a back side with a formed cavity;
- and
- a heat dissipating structure attached to the integrated circuit chip within said cavity on the back side, the heat dissipating structure being thermally conductive and having a thermal expansion compatible with the integrated circuit chip;
- wherein the heat dissipating structure comprises a body made of silicon possessing at least one cavity closed by a cover made of silicon, said at least one cavity containing a phase-change material.
1 more element
Dependencies are inferred from the claim text.