Back to results
US 9,520,325 B2Granted
Methods for producing semiconductor devices
AssigneeInfineon Technologies Austria AG
InventorAndreas Voerckel
Life of this patent
Estimating the term…
Abstract
A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first carrier; dicing the semiconductor workpiece and the carrier so as to form at least one individual semiconductor chip; mounting the at least one semiconductor chip with a side facing away from the carrier, to an additional carrier.
Claims11
A method for producing a power semiconductor device, the method comprising:
- providing a semiconductor workpiece attached to a carrier, the semiconductor workpiece comprising a semiconductor wafer including one or more kerf regions;
- dicing the semiconductor workpiece and the attached carrier so as to form at least one individual power semiconductor chip, wherein the semiconductor wafer is diced at the one or more kerf regions and the semiconductor workpiece comprises at least silicon carbide;
- mounting the at least one power semiconductor chip with a side facing away from the carrier, to an additional carrier;
- and
- removing the carrier from the mounted at least one power semiconductor chip.
2 more elements
A method for producing a power semiconductor device, the method comprising:
- providing a semiconductor workpiece attached to a carrier, the semiconductor workpiece comprising a semiconductor wafer including one or more kerf regions, wherein the carrier includes glass, graphite, plastic, or metal;
- dicing the semiconductor workpiece and the attached carrier so as to form at least one individual power semiconductor chip, wherein the semiconductor wafer is diced at the one or more kerf regions and the semiconductor workpiece comprises at least silicon carbide;
- and
- mounting the at least one power semiconductor chip with a side facing away from the carrier, to an additional carrier.
1 more element
Dependencies are inferred from the claim text.