Integrated circuit system with external resistor to provide constant current bias and method of manufacture thereof

An integrated circuit system comprising:

• an external resistor;
• and
• an integrated circuit package having a package interconnect that is connected to the external resistor, wherein the external resistor is external to the integrated circuit package, and the integrated circuit package comprises:
• a master integrated circuit die,
• a first slave integrated circuit die that is separate from the master integrated circuit die, and
• a second slave integrated circuit die that is separate from the master integrated circuit die and the first slave integrated circuit die, wherein the master integrated circuit die is electrically connected to the external resistor through the package interconnect, the master integrated circuit die is operable to generate a slave constant current based on a master constant current that flows through the package interconnect, the first and second slave integrated circuit dies receive the slave constant current from the master integrated circuit die, and no resistors external to the integrated circuit package are directly connected to the first and second slave integrated circuit dies.

An integrated circuit system comprising:

• an external resistor;
• and
• an integrated circuit package having a package interconnect that is connected to the external resistor, wherein the external resistor is external to the integrated circuit package, and the integrated circuit package comprises:
• a master integrated circuit die,
• a first slave integrated circuit die, and
• a second slave integrated circuit die, wherein the master integrated circuit die is electrically connected to the external resistor through the package interconnect, the master integrated circuit die is operable to generate a first slave constant current based on a master constant current that flows through the package interconnect, the first slave integrated circuit die receives the slave constant current from the master integrated circuit die, the first slave integrated circuit die generates a second slave constant current based on the first slave constant current, the second slave integrated circuit die receives the second slave constant current from the first slave integrated circuit die, and no resistors external to the integrated circuit package are directly connected to the first and second slave integrated circuit dies.