System and method for moving workpieces between multiple vacuum environments
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorJames P. Buonodono
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AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorJames P. Buonodono
Estimating the term…
Provided are approaches for transferring workpieces between multiple pressure environments. In one approach, a system for moving workpieces between a first pressure environment and a second pressure environment includes a first vacuum enclosure, a second vacuum enclosure, and an access port disposed between the first vacuum enclosure and the second vacuum enclosure. The system further includes a transfer carrier having a workpiece holder for retaining a workpiece, the transfer carrier disposed within the first vacuum enclosure and moveable between a first process position and a second process position, wherein in the first process position the workpiece is disposed within the first vacuum enclosure, and wherein in the second process position the workpiece holder abuts the access port to expose the workpiece to the second vacuum enclosure and to create a seal around the access port to seal the first vacuum enclosure from the second vacuum enclosure.
A system for moving workpieces between a first pressure environment and a second pressure environment, the system comprising:
A transfer carrier for moving workpieces between a first pressure environment and a second pressure environment, the transfer carrier comprising:
A method for moving workpieces between a first pressure environment and a second pressure environment, the method comprising:
Dependencies are inferred from the claim text.