Method and nozzle for hermetically sealed packaged devices
AssigneeTexas Instruments Incorporated
InventorsEdward Carl Fisher, Jane Qian Liu
Life of this patent
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Abstract
Microelectromechanical systems (MEMS) such as digital micromirror devices (DMD) are manufactured in arrays. Covers, packages, and lids are placed around each device and a liquid such as epoxy resin is dispensed around the packaged device. The epoxy resin acts as a sealant to form a hermetic seal. A nozzle comprises multiple orifices along a sidewall of the nozzle to dispense the epoxy resin horizontally and parallel to the plane of the wafer substrate. The distal ends of the nozzle are enclosed.
Claims17
A method of hermetically sealing devices, comprising:
- fabricating a plurality of devices on a device substrate;
- placing a packaging substrate below the device;
- attaching bonding wires from each device to bond pads;
- placing a cover above each device to form a plurality of packaged devices;
- spraying a sealant using a nozzle comprising multiple orifices on a sidewall of the nozzle and an enclosed distal end, onto each packaged device;
- curing the sprayed sealant;
- and
- fracturing the device and packaging substrates to singulate the plurality of packaged devices;
- wherein the spraying step comprises dispensing the sealant into a permeable material on the sidewall of the nozzle and performing a wiping action with the permeable material.
A method of hermetically sealing MEMS devices, comprising:
- fabricating a plurality of MEMS devices on a device substrate, each MEMS device comprising an array of micromirrors;
- attaching bonding wires from each MEMS device to bond pads;
- placing a packaging substrate below the MEMS device;
- placing a cover above each MEMS device to form a plurality of packaged MEMS devices;
- placing a transparent window within the cover;
- spraying a sealant using a nozzle comprising multiple orifices on a sidewall of the nozzle and an enclosed distal end, onto each packaged MEMS device;
- curing the sprayed sealant;
- and
- fracturing the device and packaging substrates to singulate the plurality of packaged MEMS devices;
- wherein the spraying step comprises dispensing the sealant into a permeable material on the sidewall of the nozzle and performing a wiping action with the permeable material.
A nozzle for spraying a sealant onto packaged devices of a wafer for hermetic sealing, comprising:
- a length greater than a height of the packaged devices;
- a width less than a space between adjacent packaged devices;
- a permeable material on a sidewall of the nozzle to perform a wiping action;
- a group of orifices on the sidewall of the nozzle to dispense the sealant into the permeable material on the sidewall, the permeable material covering the group of orifices;
- and
- an enclosed distal end.
Dependencies are inferred from the claim text.