Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

A process for fabricating an integrated circuit package, comprising:

• providing a leadframe strip having an upper surface and a lower surface;
• applying an etch-resist mask to the upper and lower surfaces;
• patterning the etch-resist mask to expose portions of the upper and lower surfaces;
• selectively etching both the upper and lower surfaces of the leadframe strip by completely etching through portions of the leadframe strip to define a die attach pad and a plurality of contact pads, and only partially etching through portions of the leadframe strip to form a plurality of spaced apart pad portions on the lower surface;
• mounting a semiconductor die to said die attach pad;
• wire bonding said semiconductor die to respective ones of said contact pads;
• encapsulating the upper surface of said leadframe strip, said semiconductor die, and wire bonds in a molding material, the lower surface of said leadframe strip being exposed;
• and
• singulating said integrated circuit package from a remainder of said leadframe strip.