Semiconductor package and fabrication method thereof

A fabrication method of a semiconductor package, comprising the steps of:

• providing a semiconductor structure comprising a carrier, a circuit portion formed on the carrier and a plurality of semiconductor chips disposed on the circuit portion;
• disposing a lamination member on the semiconductor chips, wherein the lamination member is a dummy die;
• forming an insulating layer on the circuit portion for encapsulating the semiconductor chips;
• and
• removing the carrier.

A fabrication method of a semiconductor package, comprising the steps of:

• providing a semiconductor structure comprising a carrier, a circuit portion formed on the carrier and a plurality of semiconductor chips disposed on the circuit portion;
• forming an insulating layer on the circuit portion for encapsulating the semiconductor chips;
• disposing a lamination member on the semiconductor chips and the insulating layer, wherein the lamination member is a dummy die;
• and
• removing the carrier.

A fabrication method of a semiconductor package, comprising the steps of:

• providing a semiconductor structure comprising a carrier, a circuit portion formed on the carrier and a plurality of semiconductor chips disposed on the circuit portion;
• providing a lamination member having an insulating layer and disposing the lamination member on the circuit portion through the insulating layer, wherein the insulating layer encapsulates the semiconductor chips, wherein the lamination member is a dummy die;
• and
• removing the carrier.