Method for producing mechanically flexible silicon substrate
AssigneeKing Abdullah University of Science and Technology
InventorsMuhammad M. Hussain, Jhonathan P. Rojas
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Abstract
A method for making a mechanically flexible silicon substrate is disclosed. In one embodiment, the method includes providing a silicon substrate. The method further includes forming a first etch stop layer in the silicon substrate and forming a second etch stop layer in the silicon substrate. The method also includes forming one or more trenches over the first etch stop layer and the second etch stop layer. The method further includes removing the silicon substrate between the first etch stop layer and the second etch stop layer.
Claims14
A method for making a thin silicon substrate, comprising:
- providing a silicon substrate;
- forming a first etch stop layer in a bulk portion of the silicon substrate;
- forming a second etch stop layer in the bulk portion of the silicon substrate;
- forming one or more trenches over the first etch stop layer and the second etch stop layer;
- removing the silicon substrate of the bulk portion between the first etch stop layer and the second etch stop layer by delivering chemical etchant through the formed one or more trenches;
- and
- detaching a top silicon layer from the silicon substrate to form the thin silicon substrate.
Dependencies are inferred from the claim text.