Ion beam activated directional deposition
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsTsung-Liang Chen, Mark Saly
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AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsTsung-Liang Chen, Mark Saly
Estimating the term…
Approaches herein provide precise areal surface reaction with directional ion beam activation. Exemplary approaches include selectively forming a material within a trench of a semiconductor device using a plurality of successive deposition and activation cycles. Each of the plurality of deposition and activation cycles includes forming a precursor conformally along a set of surfaces of the trench, reacting the precursor with a capping compound to form a capping layer along the set of surfaces of the trench, and performing an ion implant to the semiconductor device to activate just a portion of the capping layer. In one approach, the ion implant activates just a portion of the capping layer along a bottom surface of the trench. In another approach, the ion implant activates just a portion of the capping layer along an upper section of a sidewall of the trench.
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Dependencies are inferred from the claim text.