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US 9,520,281 B2Granted
Method of fabricating an optoelectronic device with a hollow component in epitaxial layer
AssigneeEpistar Corporation
InventorAi-Sen Liu
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Abstract
A method of fabricating an epitaxial device, comprising: providing a substrate having a first surface and a normal direction; epitaxially forming a first transition layer in a first temperature on the first surface of the substrate and in-situ incorporating a porogen into the first transition layer; and adjusting the first temperature to a second temperature to burn out the porogen from the first transition layer to form a hollow component inside the first transition layer.
Claims14
A method of fabricating an epitaxial device, comprising:
- providing a substrate having a first surface and a normal direction;
- epitaxially forming a first transition layer in a first temperature on the first surface of the substrate and in-situ incorporating a porogen into the first transition layer;
- adjusting the first temperature to a second temperature to burn out the porogen from the first transition layer;
- providing an epitaxial layer on the first transition layer;
- and
- removing the substrate from the epitaxial layer, wherein a hollow component is formed inside the first transition layer after burning out the porogen, wherein the porogen is a cyclic structure.
3 more elements
Dependencies are inferred from the claim text.