A chemical processing system configured to treat a substrate, comprising:
- a plasma generation chamber comprising a first plasma region configured to receive a first process gas at a first pressure;
- a process chamber comprising a second plasma region disposed downstream of said first plasma region and configured to receive said first process gas from said first plasma region at a second pressure;
- a first gas injection system coupled to said plasma generation chamber and configured to introduce said first process gas to said first plasma region;
- a plasma generation system coupled to said plasma generation chamber and configured to generate a first plasma at a first plasma potential in said first plasma region from said first process gas;
- a separate member disposed between said first plasma region and said second plasma region, wherein said separation member comprises one or more openings configured to allow an electron flux to flow from said first plasma region to said second plasma region to sustain a second plasma at a second plasma potential;
- a bias electrode system coupled to said process chamber and configured to elevate said second plasma potential above said first plasma potential in order to control said electron flux;
- a substrate holder coupled to said process chamber and configured to support said substrate proximate said second plasma region;
- and
- a vacuum pumping system coupled to said process chamber and configured to pump said second plasma region in said process chamber,
- wherein said separation member is composed of a dielectric material, and
- wherein one or more of said one or more openings in said separation member comprises a diameter greater than the Debye length,
- wherein said bias electrode system comprises at least one DC conductive bias electrode having a conductive surface in contact with said second plasma, and wherein said at least one DC conductive bias electrode is coupled to a DC voltage source,
- wherein said process chamber comprises:
- a chamber housing member that is fabricated from a DC conductive material and is coupled to DC ground;
- a liner member coupled to said chamber housing member that is fabricated from
- a dielectric material and is configured to electrically insulate said chamber housing member from said second plasma;
- an electrical feed-through that is configured to allow electrical connection to said at least one DC conductive bias electrode;
- and
- an electrode insulator disposed between said at least one DC conductive bias electrode and said chamber housing member and configured to electrically insulate said at least one DC conductive bias electrode from said chamber housing member.