Method and apparatus for clamping and cooling a substrate for ion implantation

A substrate clamping assembly for holding and cooling a substrate having an inside diameter (ID) during processing, the clamping assembly comprising:

• a substrate support portion configured to support a first portion of the bottom face of the substrate;
• a clamp portion configured to releasably engage a second portion of the top face of the substrate;
• a clamp actuator disposed for reciprocal movement between first and second positions within the clamp portion, the first position of the clamp actuator corresponding to an engaged configuration of the clamping assembly, and the second position of the clamp actuator corresponding to a non-engaged configuration of the clamping assembly;
• and
• a cooling arrangement thermally coupled to at least one of the substrate support portion, the clamp portion and the clamp actuator;
• wherein the substrate is clamped between the substrate support portion and the clamp portion when the clamping assembly is in the engaged configuration;
• and
• wherein the first portion of the bottom face and the second portion of the top face comprise an annular surface region surrounding the substrate ID to enable conductive cooling of the substrate via the cooling arrangement.

A substrate clamping assembly for holding a substrate having an inside diameter (ID) during processing, the clamping assembly comprising:

• a substrate support portion configured to support a portion of the bottom face of the substrate disposed immediately adjacent to the ID;
• a clamp portion configured to releasably engage a top face of the substrate disposed immediately adjacent to the ID;
• and
• a clamp actuator disposed for reciprocal movement between first and second positions within the clamp portion;
• and
• a base member, the support portion received within a recess in the base member and the clamp portion received within a recess in the support portion, wherein at least one of the base member, the support portion and the clamp portion include at least one coolant channel for receiving coolant fluid flow,
• wherein the first position of the clamp actuator corresponds to an engaged configuration of the clamping assembly, and the second position of the clamp actuator corresponds to a non-engaged configuration of the clamping assembly;
• and
• wherein the substrate is clamped between the substrate support portion and the clamp portion when the clamping assembly is in the engaged configuration, and the substrate is removable from the substrate support portion when the clamping assembly is in the non-engaged configuration.

A substrate clamping assembly for holding a substrate having an inside diameter (ID) during processing, the clamping assembly comprising:

• a substrate support portion configured to support a portion of the bottom face of the substrate disposed immediately adjacent to the ID;
• a clamp portion configured to releasably engage a top face of the substrate disposed immediately adjacent to the ID;
• and
• a clamp actuator disposed for reciprocal movement between first and second positions within the clamp portion;
• and
• a base member, the support portion received by the base member, the base member having a surface disposed adjacent to the bottom face of the substrate, the surface comprising a black body emitter coating for maximizing absorption of radiative heat energy from the substrate and for minimizing reflection of radiative heat energy from the substrate,
• wherein the first position of the clamp actuator corresponds to an engaged configuration of the clamping assembly, and the second position of the clamp actuator corresponds to a non-engaged configuration of the clamping assembly;
• and
• wherein the substrate is clamped between the substrate support portion and the clamp portion when the clamping assembly is in the engaged configuration, and the substrate is removable from the substrate support portion when the clamping assembly is in the non-engaged configuration.