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US 9,520,239 B2Granted
Chip electronic component and board having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Soo Park, Soon Ju Lee, Young Ghyu Ahn, Heung Kil Park
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Abstract
There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.
Claims6
A chip electronic component comprising:
- a ceramic body;
- external electrodes provided on both side portions of the ceramic body in a length direction;
- and
- an interposer supporting the ceramic body and electrically connected to the external electrodes,
- wherein the interposer includes:
- first and second terminal electrodes provided on both side portions thereof in the length direction;
- and
- recesses provided inwardly in the first and second terminal electrodes along the side portions of the interposer in the length direction.
5 more elements
Dependencies are inferred from the claim text.