Monolithic ceramic electronic component

A monolithic ceramic electronic component having a structure comprising:

• a ceramic multilayer body including
• stacked ceramic layers, and
• inner electrodes arranged between adjacent ceramic layers of the stacked ceramic layers;
• a first outer electrode arranged on the ceramic multilayer body, the first outer electrode being electrically connected to a first plurality of the inner electrodes;
• and
• a second outer electrode arranged on the ceramic multilayer body, the second outer electrode being electrically connected to a second plurality of the inner electrodes,
• wherein
• (a) the first and second outer electrodes each include
• an end-surface outer electrode arranged on an end surface of the ceramic multilayer body, and
• a side-surface outer electrode on side surfaces in contact with the end surface of the ceramic multilayer body, the side-surface outer electrode being electrically connected to the end-surface outer electrode, and
• (b) the side-surface outer electrode includes a first sputtered electrode layer and a second sputtered electrode layer,
• the first sputtered electrode layer contacting the ceramic multilayer body and including a material containing a first metal with a standard redox potential of about −2.36 V to about −0.74 V, a proportion of the first metal in the material being about 3% by mass or more,
• the second sputtered electrode layer including a second metal or an alloy in which a heat of solution of hydrogen is about 23.8 kJ/molH or more,
• the first sputtered electrode layer including a material that is different from a material of the end-surface outer electrode, and
• the side-surface outer electrode only overlaps an edge of the end-surface outer electrode.