Multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• a ceramic multilayer body having stacked ceramic layers and inner electrodes disposed between adjacent ceramic layers of the stacked ceramic layers;
• and
• first and second outer electrodes disposed on respective surfaces of the ceramic multilayer body, the first outer electrode being electrically connected to a first set of electrodes of the inner electrodes, and the second outer electrode being electrically connected to a second set of electrodes of the inner electrodes,
• wherein the first and second outer electrodes each include:
• an end-face outer electrode disposed on an end face of the ceramic multilayer body;
• and
• a side-face outer electrode on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode, and wherein the side-face outer electrode includes:
• (a) a first sputtered electrode layer in contact with the ceramic multilayer body, the first sputtered electrode layer including a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and
• (b) a second sputtered electrode layer which is an outermost layer constituting the side-face outer electrode and which includes at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi,
• the first sputtered electrode layer including a material that is different from a material of the end-face outer electrode, and
• the side-face outer electrode only overlaps an edge of the end-face outer electrode.