Wiring board and method for manufacturing wiring board

A wiring board, comprising:

• a substrate comprising a plurality of first insulation layers, a plurality of second insulation layers formed on the outermost first insulation layers of the first insulation layers, respectively, a plurality of third insulation layers formed on the second insulation layers, respectively, and a plurality of plain conductors formed on the third insulation layers, respectively,
• wherein the substrate has an inductor forming portion in which a plurality of inductor patterns is formed on the plurality of first insulation layers, respectively, and a plurality of first via conductors formed in the first insulation layers, respectively, such that the first via conductors are connecting the inductor patterns through the first insulation layers, the substrate has a plurality of land structures formed on the second insulation layers, respectively, and a plurality of second via conductors formed in the second insulation layers, respectively, such that the plurality of second via conductors is connecting the land structures and the outermost inductor patterns of the inductor patterns, respectively, the substrate has a plurality of third via conductors formed in the third insulation layers, respectively, such that the plurality of third via conductors is connecting the plain conductors and the land structures, respectively, and each has a central axis passing through the center of each of the third via conductors inside a projected region of a respective one of the second via conductors and that the plurality of outermost inductor patterns of the inductor patterns is formed in the substrate such that the outermost inductor patterns are separated 100 μm or more from the plain conductors, respectively.