Chip resistor and method of manufacturing the same

A method of manufacturing a chip resistor, the method comprising the steps of:

• forming a surface electrode layer on an obverse surface of a material substrate;
• forming a resistor layer on the obverse surface of the material substrate;
• defining a plurality of substrate sections in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each being elongated in a first direction and having a bottom surface, a part of the surface electrode layer being removed while each of the first grooves is being formed;
• forming a conductor layer in each of the first grooves;
• cutting the bottom surface of each of the first grooves with a dicing blade;
• and
• cutting the substrate sections in a second direction different from the first direction,
• wherein each of the first grooves has a first side surface and a second side surface that are spaced apart from each other in the second direction,
• in each of the first grooves, the conductor layer includes a first layer portion and a second layer portion that are disposed on the first side surface and the second side surface, respectively,
• the conductor layer further includes a bottom layer portion formed on the bottom surface, and the first layer portion and the second layer portion are spaced apart from each other via a vacant space in the second direction, and
• in each of the first grooves, the dicing blade cuts the bottom layer portion.