Printed circuit board and memory module including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsChil-Nam Yoon, Seon-Ryeong Kang, Hui-Chong Shin
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Abstract
A memory module includes a plurality of semiconductor memory devices and a circuit board. The circuit board is electrically connected to the plurality of semiconductor memory devices, and a signal line is disposed in the outermost layer of the circuit board. An electrical reference for the signal line is provided in a layer of the circuit board that is not adjacent to the outermost layer. Accordingly, an impedance of the signal line may be increased, and signal integrity of a signal transmitted through the signal line may be improved.
Claims20
A memory module, comprising:
- a semiconductor memory device;
- and
- a circuit board coupled to the semiconductor memory device, the circuit board including an outer layer disposed below the semiconductor memory device, an inner layer disposed below the outer layer, and an intermediate layer disposed between the inner and outer layers, wherein
- the outer layer includes a first signal line electrically connected to the semiconductor memory device, the inner layer includes a reference conductive region configured to provide an electrical reference for the first signal line, and the intermediate layer includes intermediate conductive regions.
A printed circuit board, comprising:
- a first layer including a first signal line;
- a second layer disposed below the first layer, the second layer including a power or ground plane;
- a third layer disposed below the second layer, the third layer including a second signal line and a partial plane;
- a fourth layer disposed below the third layer, the fourth layer including a third signal line;
- and
- a via connecting the first layer to the third signal line disposed in the fourth layer,
- wherein the partial plane disposed in the third layer is configured to provide an electrical reference for the first signal line disposed in the first layer.
A method of providing a memory module, comprising:
- providing a semiconductor memory device;
- and
- providing a circuit board including an outer layer having a first signal line electrically connected to the semiconductor memory device, an inner layer having a reference conductive region configured to provide an electrical reference for the first signal line disposed below the outer layer, and an intermediate layer having conductive regions disposed between the inner and outer layers.
Dependencies are inferred from the claim text.