US 9,519,319 B2 · Self-supporting thermal tube structure for electronic assemblies

Abstract

Various embodiments described herein include systems, methods and/or devices for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connecting module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

Claims24

Dependent claims

An electronic assembly for dissipating heat, comprising:

a first circuit board including a first fastener;
a second circuit board flexibly coupled to the first circuit board;
and
a connecting module including a rigid board that has a first edge flexibly coupled to the second circuit board and a second edge opposite the first edge, the second edge of the rigid board further including a second fastener that is distinct from the first fastener of the first circuit board, the second fastener configured to be received within the first fastener for coupling the rigid board directly to the first circuit board at a substantially right angle;
wherein the first and second fasteners are configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

2 more elements

A method of manufacturing an electronic assembly for dissipating heat, comprising:

providing an electronic assembly, comprising:
a first circuit board including a first fastener;
a second circuit board flexibly coupled to the first circuit board;
and
a connecting module including a rigid board that has a first edge flexibly coupled to the second circuit board and a second edge opposite the first edge, the second edge of the rigid board further including a second fastener that is distinct from the first fastener of the first circuit board, the second fastener configured to be received within the first fastener for coupling the rigid board directly to the first circuit board at a substantially right angle;
and
coupling the first circuit board to the connecting module with the first and second fasteners, such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

4 more elements

Dependencies are inferred from the claim text.

Self-supporting thermal tube structure for electronic assemblies

Life of this patent

Self-supporting thermal tube structure for electronic assemblies

Life of this patent

Abstract

Claims24