Systems and associated methods for tuning processing tools

A method comprising:

• processing wafers with a process tool;
• and
• determining that process monitor item data associated with the wafers processed by the process tool are not within specification;
• tuning a process parameter tool set of the process tool, wherein the tuning includes:
• defining behavior constraint criteria and sensitivity adjustment criteria;
• generating a set of possible tool tuning process parameter combinations using the process monitor item data associated with the wafers processed by the process tool, sensitivity data associated with a sensitivity of the process monitor items to each process parameter, the behavior constraint criteria, and the sensitivity adjustment criteria, wherein the generating the set of possible tool tuning process parameter combinations includes:
• generating a first number of possible tool tuning process parameter combinations by minimizing a value of a weighted minimization function of the sensitivity adjustment criteria, wherein the weighted minimization function defines weights of changes in process parameter values for the process parameters against changes in the process monitor item data for the process monitor items;
• generating a second number of possible tool tuning process parameter combinations from the first number of possible tool tuning process parameter combinations, wherein the second number is larger than the first number, wherein the generating the second number of possible tool tuning process parameter combinations includes:
• for each process parameter, performing a growing process to expand each set of process parameter values by including quartiles of the set of process parameter values;
• generating a set of optimal tool tuning process parameter combinations from the set of possible tool tuning process parameter combinations;
• configuring the process tool according to one of the optimal tool tuning process parameter combinations;
• and
• repeating the processing wafers and the determining that the process monitor item data associated with the wafers processed by the process tool are not within specification until the process monitor item data associated with the wafers processed by the process tool are within specification.

An integrated circuit manufacturing system comprising:

• a process tool configured to perform a process on wafers;
• and
• a process tool tuning system configured to determine a process parameter tool set for the process tool, wherein the process tool tuning system includes a tool tuning solution module configured to:
• generate a set of possible tool tuning process parameter combinations using process monitor item data associated with wafers processed by the process tool, sensitivity data associated with a sensitivity of the process monitor items to each process parameter, predefined behavior constraint criteria, and predefined sensitivity adjustment criteria, wherein the generating the set of possible tool tuning process parameter combinations includes:
• performing a trimming process to the set of possible tool tuning process parameter combinations values until a size of the set of possible tool tuning process parameter combinations is less than or equal to a predefined number, wherein the performing the trimming process includes:
• determining a process parameter having the most process parameter values;
• and
• removing a process parameter value for the process parameter;
• and
• generate a set of optimal tool tuning process parameter combinations from the set of possible tool tuning process parameter combinations.