High throughput hot testing method and system for high-brightness light-emitting diodes
AssigneeKLA-Tencor Corporation
InventorRichard W. Solarz
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AssigneeKLA-Tencor Corporation
InventorRichard W. Solarz
Estimating the term…
A method of performing a hot test of a packaged phosphor converted light-emitting diode (pc-LED) includes selectively heating portions of the phosphor layer using a laser to provide a predetermined temperature gradient in the phosphor layer. The selective heating can directly heat the silicone in a silicone-based phosphor layer, or directly heat the active ion(s) of the phosphor in a Lumiramic™-based phosphor or even the active ion(s) of a silicone-based phosphor layer. A current is applied to the InGaN film to establish a predetermined temperature at the InGaN film junction, the film junction being adjacent to the phosphor layer. Photometric measurements are performed on the LED after the selective heating and during the applied electroluminescent current. This method quickly establishes the temperatures and temperature gradients in the LED consistent with those of an operating, product-level LED, thereby ensuring accurate binning of the LED.
A method of performing a hot test of a light-emitting diode (LED), the LED including an indium-gallium-nitride (InGaN) film, and a phosphor layer formed on the InGaN film, the method comprising:
A system for hot testing of light-emitting diodes (LEDs), each LED including an indium-gallium-nitride (InGaN) film, and a phosphor layer formed on the InGaN film, the system comprising:
A method of performing a hot test of a light-emitting diode (LED), the LED including an indium-gallium-nitride (InGaN) film, and a phosphor layer formed on the InGaN film, the method comprising:
A system for hot testing of light-emitting diodes (LEDs), each LED including an indium-gallium-nitride (InGaN) film, and a phosphor layer formed on the InGaN film, the system comprising:
Dependencies are inferred from the claim text.