Integrated high-speed probe system

An integrated high-speed probe system for transmitting a grounding voltage level, a first testing signal, and a second testing signal from a tester for testing a device under test (DUT), the first testing signal having a first frequency different from a second frequency of the second testing signal, the integrated high-speed probe system comprising:

• a circuit substrate being divided into a probe area and a testing area from a center of the circuit substrate to a periphery of the circuit substrate, the circuit substrate comprising:
• an upper surface;
• a lower surface;
• a plurality of first testing contacts on the upper surface within the testing area for transmitting the first testing signal or the grounding voltage level;
• and
• a plurality of first probe contacts on the lower surface within the probe area for electrically connecting the first testing contacts respectively;
• and
• a high-speed substrate extending from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area by passing through the circuit substrate for being adjacent to the center of the circuit substrate, the high-speed substrate comprising:
• a plurality of second testing contacts corresponding to the upper surface of the circuit substrate;
• a grounding layer for electrically connecting the grounding voltage level and at least one of the first testing contacts of the circuit substrate;
• and
• a plurality of signal wires respectively and electrically connected with the second testing contacts for transmitting the second testing signal;
• wherein at least one of the second testing contacts is aligned with one of the first testing contacts of the circuit substrate.