Prober

A prober comprising:

• a wafer chuck which holds a wafer on which multiple chips having an electrode in each surface are formed and has a conductive support surface which can come into contact with a back-surface electrode of a chip;
• a movement rotation mechanism which moves and rotates the wafer chuck;
• a head stage which holds a probe holding portion having a probe that comes into contact with a front-surface electrode of the chip and connects the front-surface electrode with a terminal of a tester to electrically inspect the chip;
• a stage member which has a conductive stage surface that is formed in parallel to the support surface and electrically connected with the support surface, and can move integrally with the wafer chuck;
• and
• a contactor which is disposed in a position facing the stage member and whose tip can electrically come into contact with the stage surface, wherein:
• the stage member is separated from the wafer chuck as a separate body, and the stage surface and the support surface are electrically connected through a wiring member;
• and
• the back-surface electrode of the chip is electrically connected with the tester through the wafer chuck, the wiring member, the stage member and the contactor.